Module "FMC-4SFP+" allows to communicate the high speed hot-swappable SFP or SFP+ transceivers. The Module can be used in the systems like AMC, XMC, cPCI Serial, VPX or in the laboratory equipments.Learn More...
Development tool FlexSDR
Development tool "FlexSDR" is designed for the rapid production of complex hardware and software systems as well as for debugging and testing applications for use in the multipurpose radio electronic systems.Learn More...
- High Speed PCB based on Nelco, Megtron 6 materials. Rigid-Flex PCB. Impedance control.
- Edge plating of PCB. The different materials within one PCB.
- Finished copper thickness: 0.5-5OZ. PCB fabricates according to IPC-А-600
- High Speed serial Interconnects: HMC, Leap® On-Board Transceiver, PCI Express 3.0, QSFP28, CFP8, Display Port, HDMI;
- High Speed parallel designs: PCI-X, DDR4, QDR-IV, RLDRAM-III
- 100% handle routing method